SIS 62 Current and future of semiconductors in automotive: No progress without innovation

Session Organiser: Nobuyuki Ozaki, Nagoya University, Japan

LSIs including various chips are the key components for ITS and automotive industry. These could be processors, image sensors, power devices, communication chips, AI processed LSIs. It is said that one vehicle may use more than 100 processors. As the experiments inside laboratory, we often use high end computer systems to achieve better sensing results. However, we cannot bring those softwares into systems made for real ITS deployment especially inside vehicle. This is because high power dissipation from chips is generally unacceptable especially in vehicle and also on road side.

This is a gap between doing laboratory-based research and real deployment. Power dissipation for computation should be lower as possible by various approaches such as semiconductor design, manufacturing process and refined software. Sensor devices such as image sensors can be improved also by CMOS technology to have a good view even in worst situations.

Quality assessment for automotive is stricter than general use like consumer. Even with these restriction, high performance capability is required for current ADAS and AV systems. Even for road side, it should be taken care of the power dissipation if the number of road side becomes larger.